Axial and Radial Multilayer Ceramic Capacitors for Through-Hole Assembly

Overview

The TS17 series multilayer ceramic capacitors are available in axial and radial leaded configurations for through-hole PCB assembly.
These formats support automated insertion processes and provide stable capacitance for general electronic circuits.

Mechanical Configuration

• Axial leaded type for horizontal mounting
• Radial leaded type for vertical PCB placement
• Compatibility with automated insertion processes

Electrical Characteristics

Multilayer ceramic construction provides stable capacitance and suitable performance for signal coupling, bypass, and filtering functions in general electronic applications.

Applications

• General purpose bypass and decoupling
• Signal coupling circuits
• Through-hole PCB designs
• Industrial and consumer electronic modules

Design Considerations

• Select lead configuration based on PCB layout
• Verify capacitance value for decoupling requirements
• Ensure proper spacing for through-hole assembly
• Consider mechanical height constraints for enclosure design

Datasheet Reference

For detailed electrical specifications and dimensional drawings, refer to the TS17 series datasheet.
Download datasheet

Contact

For product selection and technical support:
Sales: sales@suntan.com.hk
General: info@suntan.com.hk