SMD Aluminum Electrolytic Capacitors for High-Density PCB Assembly

Surface mount aluminum electrolytic capacitors are widely used in compact electronic designs where volumetric efficiency and automated assembly are required.
The TS13CD series is designed for reflow soldering processes and operates at an ambient temperature of 105°C with a specified lifetime of 5000 hours.
These characteristics make it suitable for high-density surface mount applications that require stable capacitance and reliable operation.

Mechanical and Process Compatibility

For modern SMT production lines, component size and soldering compatibility are critical.
The TS13CD series supports standard reflow profiles and is available in case diameters ranging from 6.3 mm to 12.5 mm, enabling flexible PCB layout in space-constrained designs.

• SMD structure for automated placement
• Reflow soldering compatible
• Case diameters from 6.3 mm to 12.5 mm
• Optimized for high-density PCB layouts

Thermal and Lifetime Performance

Operating at 105°C with a rated lifetime of 5000 hours, the series is designed for applications where elevated temperature conditions are present.
Thermal endurance is a key parameter for power circuits and compact systems with limited airflow.

• Rated temperature: 105°C
• Lifetime specification: 5000 hours at rated temperature
• Stable performance under thermal stress
• Suitable for long-term operation in compact enclosures

Electrical Characteristics

Aluminum electrolytic capacitors are commonly used for energy storage, ripple filtering, and DC smoothing.
Their relatively high capacitance per volume makes them suitable for power management and decoupling functions in surface mount designs.

• High capacitance density
• Ripple filtering and smoothing capability
• Support for power supply stabilization
• Reliable operation in SMT assemblies

Applications

• Switching power supplies
• Industrial control electronics
• Consumer electronic devices
• Compact power modules
• High-density PCB assemblies

Design Considerations

• Verify thermal conditions in reflow and operating environments
• Ensure adequate ripple current handling in power circuits
• Consider component height and diameter for PCB layout
• Match lifetime requirements with system reliability targets

For detailed electrical ratings and dimensional specifications, refer to the TS13CD datasheet.

For design-in support and technical inquiries, please contact:

sales@suntan.com.hk

info@suntan.com.hk